A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

DARPA's Diverse Accessible Heterogeneous Integration effort is developing transistor-scale heterogeneous integration processes seeking to combine advanced compound semiconductor wafers with CMOS technology. Pictured here is a DAHI wafer. (Northrop Grumman)

The US Department of Defense (DoD) has officially announced the eight new research and development (R&D) hubs in the United States that will make up the department's new Microelectronics (ME) Commons.

The Faraday Dragon spacecraft (concept pictured above in orbit) offers small satellite performance, carrying up to 60 kg of payload and a payload power of up to 200 W, along with 1 TB of data storage, a high-rate downlink, and a mission lifetime of five years. (In-Space Missions)

BAE Systems subsidiary In-Space Missions is building an Asia-Pacific regional first satellite rideshare mission known as Faraday Dragon targeted for launch in 2026, a spokesperson for In-Space told Janes