A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

GF will receive USD17.3 million up front, as part of the contract with the department's Defense Microelectronics Activity (DMEA), according to a 21 September company statement. As per the terms of the contract, drafted by DMEA's Trusted Access Program Office (TAPO), the Pentagon and department contractors will have access to GF-built semiconductor technologies over the next decade, the statement said.

Aside from DoD access to domestically built ME systems and components from GF, the Pentagon will also have access to the company's “design ecosystem, IP [internet protocol] libraries, early access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing”, the statement noted.

A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

GF will receive USD17.3 million up front, as part of the contract with the department's Defense Microelectronics Activity (DMEA), according to a 21 September company statement. As per the terms of the contract, drafted by DMEA's Trusted Access Program Office (TAPO), the Pentagon and department contractors will have access to GF-built semiconductor technologies over the next decade, the statement said.

Aside from DoD access to domestically built ME systems and components from GF, the Pentagon will also have access to the company's “design ecosystem, IP [internet protocol] libraries, early access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing”, the statement noted.

A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

GF will receive USD17.3 million up front, as part of the contract with the department's Defense Microelectronics Activity (DMEA), according to a 21 September company statement. As per the terms of the contract, drafted by DMEA's Trusted Access Program Office (TAPO), the Pentagon and department contractors will have access to GF-built semiconductor technologies over the next decade, the statement said.

Aside from DoD access to domestically built ME systems and components from GF, the Pentagon will also have access to the company's “design ecosystem, IP [internet protocol] libraries, early access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing”, the statement noted.

A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

GF will receive USD17.3 million up front, as part of the contract with the department's Defense Microelectronics Activity (DMEA), according to a 21 September company statement. As per the terms of the contract, drafted by DMEA's Trusted Access Program Office (TAPO), the Pentagon and department contractors will have access to GF-built semiconductor technologies over the next decade, the statement said.

Aside from DoD access to domestically built ME systems and components from GF, the Pentagon will also have access to the company's “design ecosystem, IP [internet protocol] libraries, early access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing”, the statement noted.

A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

GF will receive USD17.3 million up front, as part of the contract with the department's Defense Microelectronics Activity (DMEA), according to a 21 September company statement. As per the terms of the contract, drafted by DMEA's Trusted Access Program Office (TAPO), the Pentagon and department contractors will have access to GF-built semiconductor technologies over the next decade, the statement said.

Aside from DoD access to domestically built ME systems and components from GF, the Pentagon will also have access to the company's “design ecosystem, IP [internet protocol] libraries, early access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing”, the statement noted.

A new, flexible silicon-on-polymer semiconductor chip developed by the US Air Force Research Laboratory. (US Air Force)

The US Department of Defense (DoD) has inked a 10-year, USD3.1 billion semiconductor manufacturing deal with New York-based GlobalFoundries (GF), to produce critical microelectronics (ME) for current and future aerospace systems and weapons platforms.

GF will receive USD17.3 million up front, as part of the contract with the department's Defense Microelectronics Activity (DMEA), according to a 21 September company statement. As per the terms of the contract, drafted by DMEA's Trusted Access Program Office (TAPO), the Pentagon and department contractors will have access to GF-built semiconductor technologies over the next decade, the statement said.

Aside from DoD access to domestically built ME systems and components from GF, the Pentagon will also have access to the company's “design ecosystem, IP [internet protocol] libraries, early access to new technologies in development, quick and efficient prototyping, and full-scale volume manufacturing”, the statement noted.