A new, flexible silicon-on-polymer chip developed by the US Air Force Research Laboratory (AFRL) and American Semiconductor has a memory capability 7,000 times above the current slate of flexible, integrated circuits on the market. (US Air Force )

US semiconductor companies Intel and Qorvo are poised to deliver a critical microelectronics (ME) technology prototype to the US Department of Defense (DoD) by April for integration into military systems and platforms across the US armed forces.

Intel and Qorvo will transition their multichip packaging (MCP) prototype dubbed ‘Belmont Bay' to lead system integrator BAE Systems on 6 April, according to a 16 March statement by BAE Systems.Under Secretary of Defense for Research and Engineering Heidi Shyu will oversee the prototype handover, the statement added.

The MCP prototype integration into Pentagon and service-led systems will be carried out under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) programme, led by the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).

A new, flexible silicon-on-polymer chip developed by the US Air Force Research Laboratory (AFRL) and American Semiconductor has a memory capability 7,000 times above the current slate of flexible, integrated circuits on the market. (US Air Force )

US semiconductor companies Intel and Qorvo are poised to deliver a critical microelectronics (ME) technology prototype to the US Department of Defense (DoD) by April for integration into military systems and platforms across the US armed forces.

Intel and Qorvo will transition their multichip packaging (MCP) prototype dubbed ‘Belmont Bay' to lead system integrator BAE Systems on 6 April, according to a 16 March statement by BAE Systems.Under Secretary of Defense for Research and Engineering Heidi Shyu will oversee the prototype handover, the statement added.

The MCP prototype integration into Pentagon and service-led systems will be carried out under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) programme, led by the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).

A new, flexible silicon-on-polymer chip developed by the US Air Force Research Laboratory (AFRL) and American Semiconductor has a memory capability 7,000 times above the current slate of flexible, integrated circuits on the market. (US Air Force )

US semiconductor companies Intel and Qorvo are poised to deliver a critical microelectronics (ME) technology prototype to the US Department of Defense (DoD) by April for integration into military systems and platforms across the US armed forces.

Intel and Qorvo will transition their multichip packaging (MCP) prototype dubbed ‘Belmont Bay' to lead system integrator BAE Systems on 6 April, according to a 16 March statement by BAE Systems.Under Secretary of Defense for Research and Engineering Heidi Shyu will oversee the prototype handover, the statement added.

The MCP prototype integration into Pentagon and service-led systems will be carried out under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) programme, led by the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).

A new, flexible silicon-on-polymer chip developed by the US Air Force Research Laboratory (AFRL) and American Semiconductor has a memory capability 7,000 times above the current slate of flexible, integrated circuits on the market. (US Air Force )

US semiconductor companies Intel and Qorvo are poised to deliver a critical microelectronics (ME) technology prototype to the US Department of Defense (DoD) by April for integration into military systems and platforms across the US armed forces.

Intel and Qorvo will transition their multichip packaging (MCP) prototype dubbed ‘Belmont Bay' to lead system integrator BAE Systems on 6 April, according to a 16 March statement by BAE Systems.Under Secretary of Defense for Research and Engineering Heidi Shyu will oversee the prototype handover, the statement added.

The MCP prototype integration into Pentagon and service-led systems will be carried out under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) programme, led by the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).

A new, flexible silicon-on-polymer chip developed by the US Air Force Research Laboratory (AFRL) and American Semiconductor has a memory capability 7,000 times above the current slate of flexible, integrated circuits on the market. (US Air Force )

US semiconductor companies Intel and Qorvo are poised to deliver a critical microelectronics (ME) technology prototype to the US Department of Defense (DoD) by April for integration into military systems and platforms across the US armed forces.

Intel and Qorvo will transition their multichip packaging (MCP) prototype dubbed ‘Belmont Bay' to lead system integrator BAE Systems on 6 April, according to a 16 March statement by BAE Systems.Under Secretary of Defense for Research and Engineering Heidi Shyu will oversee the prototype handover, the statement added.

The MCP prototype integration into Pentagon and service-led systems will be carried out under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) programme, led by the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).

A new, flexible silicon-on-polymer chip developed by the US Air Force Research Laboratory (AFRL) and American Semiconductor has a memory capability 7,000 times above the current slate of flexible, integrated circuits on the market. (US Air Force )

US semiconductor companies Intel and Qorvo are poised to deliver a critical microelectronics (ME) technology prototype to the US Department of Defense (DoD) by April for integration into military systems and platforms across the US armed forces.

Intel and Qorvo will transition their multichip packaging (MCP) prototype dubbed ‘Belmont Bay' to lead system integrator BAE Systems on 6 April, according to a 16 March statement by BAE Systems.Under Secretary of Defense for Research and Engineering Heidi Shyu will oversee the prototype handover, the statement added.

The MCP prototype integration into Pentagon and service-led systems will be carried out under the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) programme, led by the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).