The research arm of the US intelligence community is developing the ability to analyse and verify the reliability of integrated circuits to ensure integrity of manufacturing processes and the supply chain.
The objective of the Intelligence Advanced Research Projects Activity's (IARPA) Rapid Analysis of Various Emerging Nanoelectronics (RAVEN) programme is to develop tools capable of imaging minimum-size circuit features on a silicon integrated circuit chip, particularly metal, polysilicon, vias, contacts, shallow trench isolation regions, and dielectrics, according to an agency statement.
"Between 2011 and 2015, the semiconductor industry saw significant advances in both the scaling of integrated circuits and 3-D integration of multiple wafers, monolithically grown stacked circuits, and non-CMOS [complementary metal-oxide-semiconductor] structures," IARPA said in a statement.
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